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[讨论] 请问有谁对COF(Chip On Film )基板&COF封装技术感兴趣?

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发表于 2008-7-24 17:59:20 | 显示全部楼层 |阅读模式
COF is a new type chip package on which IC chip is directly mounted to the surface of flex circuit so that its packaging process is very simple compared with conventional package and due to its high flexibility, the package can be fold or rolled or vent. This advantage can make COF to be applied to a very small electronic appliance like a multi function cell phone or LCD Driver IC for high quality plat display adopted to PDP, TFT-LCD, oled or others which has many electronic signal path on gate or source connector. COF also has wide application area where needed high density with flexibility.More and more Multifunctional digital device requires package chips with less weight & size but with higher performance .Chip-On-Film technology meets the demands of the semiconductor packaging market for drive IC, it will become the major trend in the soon coming future..................
Chip-On-Film Illustration1.jpg
 楼主| 发表于 2010-4-20 17:40:06 | 显示全部楼层
风扬电容触摸屏
COF(Chip on Film)厂商COF(Chip-on-Film)工艺设计
COF(Chip on Film)封装供应商TCP & COF& COF 工艺比较
发表于 2011-4-14 09:59:12 | 显示全部楼层
我司有生產tcp/cog/cof之bonding tool如有須要請聯繫
tim.wu@is-made.com
qq 1047494097
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